EP17HT-LO

Master Bond EP17HT-LO is an extraordinary one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features excellent physical properties, a superb electrical insulation profile and chemical resistance even with heat exposure to 600°F. Its glass transition temperature (T_g) is 200 to 210°C. This system is also distinctive in that it has very low exotherm upon curing and can be used in castings and encapsulations well beyond ½ inch in thickness. The minimum curing temperature for EP17HT-LO is 300°F with faster cures attainable at higher temperatures. Please refer to the curing section for additional details.

EP17HT-LO is 100% reactive and contains no solvents or diluents. EP17HT-LO bonds well to similar as well as dissimilar substrates such as metal, ceramics, plastics and composites. It resists many chemicals such as acids, bases, salts, fuels, oils and many solvents. Shrinkage upon cure is minimal. It is serviceable from -80°F to +600°F. This system is tan in color. EP17HT-LO retains its exceptional electrical insulation properties, even at higher temperatures. It should be noted, in order to obtain the optimum properties, a post cure of 2-12 hours at 350°F is recommended. As mentioned above, EP17HT-LO meets NASA low outgassing specifications. It is widely used in a variety of applications in the aerospace, oil and chemical processing, optical, optoelectronic and specialty OEM industries.

Product Advantages

• Single component system; no mixing prior to use. Contains no solvents, diluents or volatiles
• Easy application; only contact pressure required during heat cure
• Superior chemical resistance
• Exceptionally high temperature resistance
• Low exotherm upon curing