UV22DC80-1Med

Master Bond UV22DC80-1Med is a nanosilica filled, dual cure epoxy based system. This kind of system utilizes light for the initial cure and then requires heat to complete the curing in those shadowed out areas that are not accessible to the UV light. UV22DC80-1Med cross links rapidly upon exposure to UV light at 320-365 nm with 20-40 milliwatts/cm² of energy. Faster cures can be achieved by higher energy outputs. The cure is then completed by adding heat with a minimum of 80°C to initiate polymerization. Areas not exposed to UV light because of shadowing cure at 80-90°C for 45-60 minutes with a post cure of 90-110°C for 1-2 hours. Post curing enhances the system’s physical properties, including glass transition temperature and chemical resistance. This dual-cure system ensures thorough and reliable curing, even in complex geometries.

UV22DC80-1Med bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. It is highly resistant to acids, bases, solvents, and numerous sterilants, including ethylene oxide and gluteraldehyde. It also withstands repeated autoclaving. UV22DC80-1Med is a lower viscosity system with exceptionally low shrinkage and outstanding dimensional stability. It is not oxygen inhibited. It is a superb electrical insulator, and is able to withstand rigorous thermal cycling and abrasion. The service temperature range is -60°F to +350°F. UV22DC80-1Med is recommended for medical device manufacturing, particularly for reusable instruments that require repeated sterilization, especially autoclaving and aggressive liquid sterilants.

Product Advantages

• One component system, no mixing needed
• Cures in shadowed out areas with heat
• No oxygen inhibition
• Excellent physical strength properties
• Nano filled--high dimensional stability, resists abrasion
• Passes ISO 10993-5 and USP Class VI