Supreme 3HTND-2DM-1

One component epoxy featuring non drip consistency for bonding, sealing and specialty dam-and-fill encapsulation
Key Features
  • Toughened system
  • Fast curing
  • Good physical strength properties
  • Convenient packaging and dispensing
Typical Properties
Viscosity
paste
Cure Schedule
20-30 minutes at 250°F or 5-10 minutes at 300°F
Hardness
80-90 Shore D
Service Temperature Range
-100°F to +400°F
Dielectric Constant
4.6 @ 75°F, 60 Hz
Tensile Modulus
300,000-350,000 psi
One Part Epoxy Supreme 3HTND-2DM-1
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
Applications

Bonding

bonding

Sealing

sealing

Gap Filling

gap_filling
Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863

Packaging

Syringe

Product Description

Master Bond Supreme 3HTND-2DM-1 is a rapid curing, toughened, one part epoxy. It can be used in numerous ways. These include various bonding and sealing applications especially where high strength and easy, fast processing are important. Another is for chip on board encapsulations. This refers to using the epoxy as a damming or blocking system. Specifically, it is intended to block the flow of still another epoxy that is encapsulating chips and wire bonds.

Supreme 3HTND-2DM-1 requires no mixing and cures readily at elevated temperatures. The minimum curing temperature schedule is 20-30 minutes at 250°F with an alternative being 5-10 minutes at 300°F. It is not premixed and frozen and its working life at room temperature is unlimited. It has a paste consistency making it well suited for bonding applications as well as for damming on circuit boards.

This epoxy bonds well to a wide variety of substrates including metals, composites, ceramics and many plastics. It provides excellent thermal conductivity while retaining superior electrical insulation values. It offers very good epoxy type chemical resistance to fuels, oils, water and cleaning agents. It has inherent toughness as well as the ability to withstand aggressive thermal cycling. The service temperature ranges from -100°F to +400°F. Its color is black but other options are available. Supreme 3HTND- 2DM-1 passes the NASA low outgassing test which allows it to be used in vacuum, aerospace, electro-optic and other related applications. Also, is has very low ionic levels of chlorine, sodium and potassiu < 10 ppm. These particular product attributes allow this epoxy to be used in aerospace, electro-optics, specialty OEM and related industries. Additionally, it fits nicely as a barrier material in electronic and semiconductor applications.

Product Advantages

  • Single component system; no mixing
  • Unlimited open time; rapid cure with heat
  • Versatile high strength adhesive
  • Reliable sealant
  • Ideal consistency for forming dams and barriers
  • Passes NASA low outgassing
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
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How to order

Verify Your Product Selection

With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

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Our customer service team will follow up with a detailed quote with packaging and shipping options.

Place Your Order

We'll work with your company to process the order efficiently.

Receive Your Material

Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.

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