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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21AOLV-2Med Two component epoxy compound for bonding, coating, sealing and encapsulation Coefficient of Thermal Expansion 22-25 x 10⁻⁶ in/in/°C Dielectric Strength >400 volts/mil	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Encapsulation Potting Gap Filling Casting	Part A: 1,500-3,000 cps, Part B: 50,000-150,000 cps	overnight at 75°F followed by 2-4 hours at 150-200°F	>80 Shore D	-60°F to +250°F	/tds/ep21aolv-2med
EP21AOND Two component epoxy compound for high performance applications Dielectric Strength >400 volts/mil Tensile Lap Shear Strength >1,200 psi	RoHS Compliant	Bonding Sealing Gap Filling	paste	75°F: 3-4 days; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F followed by 3-4 hours at 150-200°F	>80 Shore D	-60°F to +250°F	/tds/ep21aond
EP21AR Two part epoxy adhesive, sealant, coating and encapsulating system featuring superb acid resistance Coefficient of Thermal Expansion 40-45 in/in X 10⁻⁶/°C Dielectric Strength 440 volts/mil	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 10,000-15,000 cps, Part B: 4,000-6,000 cps	75°F: 24-48 hours; 200°F: 2-3 hours	80-90 Shore D	-60°F to +250°F	/tds/ep21ar
EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Dielectric Strength 440 volts/mil Tensile Modulus 400,000-450,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 60,000-110,000 cps, Part B: 4,000-6,000 cps	75°F for 24-48 hours, 200°F for 2-3 hours	80-90 Shore D	-60°F to +400°F	/tds/ep21arht
EP21ARHTND-2 Two component epoxy adhesive, sealant and coating featuring exceptional resistance to acids Dielectric Constant 3.8 Tensile Lap Shear Strength 2,200-2,400 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: paste	75°F: 24-48 hours; 200°F: 2-3 hours	75-85 Shore D	-60°F to +400°F	/tds/ep21arhtnd-2
EP21ARLV Two part epoxy adhesive, sealant, coating and encapsulating system featuring low viscosity and superior acid resistance Dielectric Constant 3.8 Dielectric Strength 440 volts/mil	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 3,000-6,000 cps, Part B: 4,000-6,000 cps	overnight at 75°F followed by 4 to 6 hours at 150-200°F	80-90 Shore D	-60°F to +250°F	/tds/ep21arlv
EP21BAS Two component, radiopaque epoxy system for bonding, sealing, coating and encapsulation Dielectric Strength 440 volts/mil Tensile Lap Shear Strength >1,000 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	75°F: 48-72 hours; 200°F: 2-3 hours	>60 Shore D	-60°F to +250°F	/tds/ep21bas
EP21FL Toughened, two component epoxy for bonding, sealing and encapsulation Tensile Modulus 150,000-200,000 psi Volume Resistivity 10¹⁴ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling Potting	2,000-4,500 cps	Optimum cure schedule: overnight at 75°F plus 2-3 hours at 150-200°F	40-50 Shore D	-100°F to +250°F	/tds/ep21fl
EP21FRNS-2 Two component epoxy system for potting, encapsulating and casting Dielectric Constant 4.5 Tensile Lap Shear Strength >1,200 psi	RoHS Compliant UL 94V-0 Flame Resistant	Casting Encapsulation Potting Sealing	Part A: 40,000-70,000 cps, Part B: 30,000-45,000 cps	Cures at 75°F, 48-72 hours	>75 Shore D	-59.8°F to +194°F	/tds/ep21frns-2
EP21H Two component epoxy compound for high performance applications Refractive Index 1.54 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Casting	3,000-6,000 cps	12-24 hours at 75°F, plus 3-4 hours at 150°F	>75 Shore D	-60°F to +250°F	/tds/ep21h

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