Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21LVSP6 Two component epoxy for bonding, sealing, coating and encapsulating Dielectric Strength 450 volts/mil Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant MIL-STD-810G for Fungus Resistance	Bonding Sealing Coating Casting Encapsulation	Part A: 1,500-3,000 cps, Part B: 5,000-8,000 cps	75°F: 3-5 days; 200°F: 3-4 hours.	65-75 Shore D	-60°F to +250°F	/tds/ep21lvsp6
EP21LVTK-2 Two component epoxy system for bonding, sealing, coating, and casting Dielectric Strength 440 volts/mil Tensile Lap Shear Strength 2,800-3,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling	27,000-33,000 cps	overnight at 75°F, followed by a post cure at 150-200°F for 2-3 hours	>70 Shore D	-60°F to +250°F	/tds/ep21lvtk-2
EP21ND Two component epoxy compound for high performance applications Dielectric Constant 2.92 Tensile Lap Shear Strength >2,500 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	48-72 hours at 75°F	>70 Shore D	-60°F to +250°F	/tds/ep21nd
EP21ND-2 Two component epoxy compound for high performance applications Dielectric Constant 2.92 Tensile Lap Shear Strength >2,500 psi	RoHS Compliant	Bonding Sealing Coating	paste	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure schedule: 12-24 hours at 75°F, plus 2 hours at 150-200°F	>70 Shore D	-60°F to +250°F	/tds/ep21nd-2
EP21ND-LO Two component, non-drip epoxy system for bonding, sealing and coating applications Dielectric Constant 2.92 at 75°F, 60 Hz Tensile Lap Shear Strength >2,500 psi at 75°F	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	12-24 hours at 75°F, plus another 2 hours at 150-200°F	>70 Shore D	-60°F to +250°F	/tds/ep21nd-lo
EP21ND-LP Two component epoxy compound for high performance applications featuring convenient handling and a long working life Dielectric Constant 2.92 Tensile Lap Shear Strength 2,600-2,800 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	75°F: 3-4 days; 150-200°F: 3-4 hours; Optimum cure schedule: 12-24 hours at 75°F, plus 3 hours at 150-200°F	70-80 Shore D	-60°F to +250°F	/tds/ep21nd-lp
EP21NDCL Two component epoxy compound for high performance bonding, sealing and coating Tensile Lap Shear Strength 2,600-2,800 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	75°F: 48-72 hours	70-80 Shore D	-60°F to +250°F	/tds/ep21ndcl
EP21NDFG Two component epoxy compound for high performance applications Tensile Lap Shear Strength >2500 psi Volume Resistivity >10¹⁴ ohm-cm	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	48-72 hours at 75°F	>70 Shore D	-60°F to +250°F	/tds/ep21ndfg
EP21NS Two part, moderate viscosity, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation Dielectric Constant 2.8 Refractive Index 1.55	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	50,000-90,000 cps	overnight at 75°F, followed by 4-5 hours at 150°F	75-85 Shore D	-80°F to +250°F	/tds/ep21ns
EP21QF Two component, room temperature curing epoxy featuring easy processing and good physical strength properties Dielectric Constant 3.4 Dielectric Strength >450 volts/mil	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	20,000-30,000 cps	1 hour at 65°C for 22 grams	75-85 Shore D	-80°F to +300°F	/tds/ep21qf

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