Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply. Supreme 10HTF-1 is a true one part system; it is not premixed and frozen and has an unlimited working life at room temperature. It is rapid curing: 5-10 minutes at 300°F or 15-20 minutes at 250°F. It should be noted that post curing at 250-300°F for 1-2 hours will help optimize the properties.
Gap Filling
Master Bond EP13SPND-2 is a one component, heat curing epoxy with prominent temperature resistance and stellar bonding attributes. This one part system will cure at temperatures of 300-350°F for 60-90 minutes. For optimum properties, a post cure of 2 hours at 350-400°F is highly recommended. It is primarily used as a structural adhesive. EP13SPND-2 is somewhat exothermic and is typically cured in bond line thickness of 2-8 thousandths of an inch. The system has a paste consistency that is easy to apply and will not flow when cured.