Master Bond EP21NDCL is a two component, room temperature curing epoxy system that has a non-drip consistency. What is really eye-catching about this product is that even though Part A is translucent and Part B is light amber, upon mixing it cures optically clear, especially in thin sections. EP21NDCL combines easy processing, outstanding physical strength properties along with excellent electrical insulation values. The processing is straightforward and relatively easy; the mix ratio is a non-critical 1 to 1 by weight or volume.
Gap Filling
Master Bond EP41S-5 is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5 will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has exemplary resistance to a wide array of chemicals, especially acids, bases, alcohols, fuels and solvents. Most noteworthy is its resistance to methylene chloride, phenol (10%), nitric acid (30%) as well as ethanol and acetone.
Master Bond EP31ND is a two part epoxy system used mostly for bonding, but is also serviceable for sealing and encapsulation. This compound has a forgiving mix ratio of 100 to 30 by weight and contains no solvents or diluents. It cures readily at room temperature or more rapidly at elevated temperatures. At ambient temperatures it cures in about 1-2 days, and at 200°F, the curing time is about 2-3 hours. To optimize properties, an overnight cure at room temperature followed by 2-3 hours at 150-200°F is desirable.
Master Bond EP21HTFG is a two component, room temperature curing epoxy adhesive, sealant and coating. Its most outstanding features are easy handling, superb physical strength properties and superior resistance to higher temperatures. The two parts are easy to mix and the ratio is very forgiving either by weight or volume. It cures readily at room temperature or faster at elevated temperatures with the optimum being overnight at room temperature followed by 1-2 hours at 150-200°F.
Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving and convenient one to one mix ratio by weight or volume. It cures at ambient temperatures that can be accelerated by adding heat, with the optimum cure schedule being overnight at room temperature, followed by 1-2 hours at 150-200°F. This non-drip viscosity system bonds well and with minimum shrinkage to a wide variety of substrates including metals, composites, glass, ceramics and many plastics and rubbers.
Master Bond EP21AOND is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with an excellent performance profile and easy handling. It has a forgiving one to one mix ratio by weight or volume along with a paste consistency. It cures at ambient temperatures or more rapidly at elevated temperatures with the optimum schedule being overnight at room temperature followed by a few hours at 150-200°F. Most importantly, it is an excellent thermal conductor yet maintains superior electrical insulation values.
Master Bond EP45HTND-2 is a two component epoxy system with exceptional performance as an adhesive, sealant and coating in hostile environments. It is most noteworthy for its exquisite resistance to elevated temperatures and its ability to withstand many problem type chemicals. EP45HTND-2 is a specialty type system with a 100 to 30 mix ratio by weight. It has a paste viscosity and will not flow while curing, but it is easy to mix at room temperature. It requires oven curing for 3-4 hours at 250°F or 2-3 hours at 300°F.
Master Bond EP3SP5FL-ND2 is a special epoxy adhesive that requires no mixing, offers an unsurpassed curing speed of 1-2 minutes at 300°F and a very good performance profile. It is a paste viscosity with minimal flow upon curing that is easy to apply. Since it requires curing at 300°F, it essentially has unlimited working life at room temperature. It will bond well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics.
Master Bond Supreme 45HTND-2 is a two component epoxy system featuring an attractive blend of superior physical properties especially shear and peel strengths for high performance structural bonding applications. It has a fine temperature resistance range of -100°F to +450°F. It is 100% reactive and does not contain any solvents or diluents. Supreme 45HTND-2 is primarily formulated to withstand rigorous thermal cycling, especially when bonding dissimilar substrates.
Master Bond Supreme 11HTLP is a high performance, higher viscosity, two part epoxy for bonding and sealing. It is exceptionally easy to use with a one to one mix ratio by weight or volume. Supreme 11HTLP has a convenient working life and cures readily at room temperature or more quickly at elevated temperatures. The optimum curing schedule is overnight at room temperature, followed by 2-3 hours at 150-200°F. Supreme 11HTLP is formulated to have imposing toughness, which in turn imparts high bond strengths in both the shear and peel mode.