Master Bond X5N is a solvent based elastomeric system with good electrical conductivity. It has a paste-like consistency and is very easy to use. When used as an adhesive, it is simply applied in a thin layer to one of the substrates. The surfaces are then mated and fixtured, and the product is allowed to cure. Additionally, it can be applied in a similar manner as a coating material for shielding purposes. Curing in either case is generated by the evaporation of the solvent.
Coating
Master Bond X5SC is a solvent based elastomeric system with superb electrical conductivity. It has a paste-like consistency and is very easy to use. When used as an adhesive, it is simply applied in a thin layer to one of the substrates. The surfaces are then mated and fixtured, and the product is allowed to cure. Additionally, it can be applied in a similar manner as a coating material for shielding. Curing in either case is generated by the evaporation of the solvent.
Master Bond UV15DC80LV is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” issues. Most noteworthy is that the heat cure portion can be initiated at only 80°C rather than at the more common 125°C. Another very useful feature of a dual cure UV is that it allows for rapid fixturing and then enables the cure to be completed by adding heat.
Master Bond Supreme 34CA is a two component epoxy system specially formulated to resist higher temperatures and aggressive chemicals. This lower viscosity material has an easy to use 100 to 50 mix ratio by weight. It will not cure at room temperature and it has an exceptionally long working life, far exceeding 24 hours. Although, it is slightly exothermic, it can be cured in sections exceeding 1/4 inch thick. Particular attention should be paid to the curing schedule.
Master Bond EP21NDCL is a two component, room temperature curing epoxy system that has a non-drip consistency. What is really eye-catching about this product is that even though Part A is translucent and Part B is light amber, upon mixing it cures optically clear, especially in thin sections. EP21NDCL combines easy processing, outstanding physical strength properties along with excellent electrical insulation values. The processing is straightforward and relatively easy; the mix ratio is a non-critical 1 to 1 by weight or volume.
Master Bond EP41S-5 is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5 will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has exemplary resistance to a wide array of chemicals, especially acids, bases, alcohols, fuels and solvents. Most noteworthy is its resistance to methylene chloride, phenol (10%), nitric acid (30%) as well as ethanol and acetone.
Master Bond EP31ND is a two part epoxy system used mostly for bonding, but is also serviceable for sealing and encapsulation. This compound has a forgiving mix ratio of 100 to 30 by weight and contains no solvents or diluents. It cures readily at room temperature or more rapidly at elevated temperatures. At ambient temperatures it cures in about 1-2 days, and at 200°F, the curing time is about 2-3 hours. To optimize properties, an overnight cure at room temperature followed by 2-3 hours at 150-200°F is desirable.
Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its most outstanding features are easy handling, exceptional physical strength properties and resistance to higher temperatures. The two parts are easy to mix and the ratio is very forgiving either by weight or volume. It cures readily at room temperature or faster at elevated temperatures with the optimum being overnight at room temperature followed by 1-2 hours at 150-200°F.
Master Bond EP21HTFG is a two component, room temperature curing epoxy adhesive, sealant and coating. Its most outstanding features are easy handling, superb physical strength properties and superior resistance to higher temperatures. The two parts are easy to mix and the ratio is very forgiving either by weight or volume. It cures readily at room temperature or faster at elevated temperatures with the optimum being overnight at room temperature followed by 1-2 hours at 150-200°F.
Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving and convenient one to one mix ratio by weight or volume. It cures at ambient temperatures that can be accelerated by adding heat, with the optimum cure schedule being overnight at room temperature, followed by 1-2 hours at 150-200°F. This non-drip viscosity system bonds well and with minimum shrinkage to a wide variety of substrates including metals, composites, glass, ceramics and many plastics and rubbers.