Master Bond EP45HTND-2 is a two component epoxy system with exceptional performance as an adhesive, sealant and coating in hostile environments. It is most noteworthy for its exquisite resistance to elevated temperatures and its ability to withstand many problem type chemicals. EP45HTND-2 is a specialty type system with a 100 to 30 mix ratio by weight. It has a paste viscosity and will not flow while curing, but it is easy to mix at room temperature. It requires oven curing for 3-4 hours at 250°F or 2-3 hours at 300°F.
Coating
Master Bond EP21H is a two component epoxy system with exceptionally good clarity and a unique optical transmission profile for an epoxy. Nearly all epoxies display minimal light transmission below 330 nm. EP21H has a special crosslinking profile that allows for exceptional light transmission in the 250-365 nm spectra. The light transmission in sections of 0.005 inch or less exceeds almost 95% from 260-2,000 nm. EP21H is easy to handle having a long open time. EP21H will cure at room temperature and it can be accelerated by adding heat.
Master Bond EP3SP5FL-ND2 is a special epoxy adhesive that requires no mixing, offers an unsurpassed curing speed of 1-2 minutes at 300°F and a very good performance profile. It is a paste viscosity with minimal flow upon curing that is easy to apply. Since it requires curing at 300°F, it essentially has unlimited working life at room temperature. It will bond well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics.
Master Bond MB600SCN is an aqueous based, sodium silicate system with a silver coated nickel filler. It is intended for use in applications where very good shielding effectiveness is required and cost considerations might be more pronounced. Electromagnetic interference (EMI) and radio frequency interference (RFI) are very important factors in electronic applications. The energy emitted from various sources such as radios, appliances, etc. can interfere with other electronic devices that are made from plastics.
Master Bond Supreme 45HTND-2 is a two component epoxy system featuring an attractive blend of superior physical properties especially shear and peel strengths for high performance structural bonding applications. It has a fine temperature resistance range of -100°F to +450°F. It is 100% reactive and does not contain any solvents or diluents. Supreme 45HTND-2 is primarily formulated to withstand rigorous thermal cycling, especially when bonding dissimilar substrates.
Master Bond Supreme 11HTLP is a high performance, higher viscosity, two part epoxy for bonding and sealing. It is exceptionally easy to use with a one to one mix ratio by weight or volume. Supreme 11HTLP has a convenient working life and cures readily at room temperature or more quickly at elevated temperatures. The optimum curing schedule is overnight at room temperature, followed by 2-3 hours at 150-200°F. Supreme 11HTLP is formulated to have imposing toughness, which in turn imparts high bond strengths in both the shear and peel mode.
Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply. Supreme 10HTF-1 is a true one part system; it is not premixed and frozen and has an unlimited working life at room temperature. It is rapid curing: 5-10 minutes at 300°F or 15-20 minutes at 250°F. It should be noted that post curing at 250-300°F for 1-2 hours will help optimize the properties.
Master Bond EP76MHT is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing and coating. EP76MHT is easy to use has a thixotropic viscosity with Part A being greater than 700,000 cps and Part B exceeding 1,000,000 cps. It has a paste like consistency and the mix ratio is a forgiving one to one by weight or volume. It has an exceptionally long working life as well. It will cure readily at ambient temperatures in 3-5 days or at 200°F in 2-3 hours.