EP30NS

Master Bond EP30NS is a nanosilica filled, moderate viscosity epoxy with good flow. It can be used for high performance bonding, sealing, coating and encapsulation. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum cure is overnight at room temperature, followed by 2-3 hours at 150-200°F. It has an easy to use, non-critical four to one mix ratio by weight. This system is 100% reactive and does not contain any solvents or diluents. It is especially recommended when a moderate viscosity epoxy with high dimensional stability and good physical strength properties are desired.

It adheres well to a wide variety of materials including metals, composites, glass, ceramics, rubbers and many plastics. The cured system has top notch electrical insulation properties. It resists many chemicals including water, oils, fuels, acids, bases and solvents. The special property profile of this system is due to the nanosilica component of the formulation. It also gives the EP30NS much higher abrasion resistance than typical epoxy and much lower shrinkage upon curing (linear shrinkage, less than 0.01%). The service temperature range is -60°F to +300°F. Part A is translucent, Part B is transparent. This system is intended to be used in the aerospace, electronic, optical, opto-electronic and specialty OEM applications where the property enhancements due to the properties of the nanosilica are desirable.

Product Advantages

• Convenient mixing: moderate viscosity, easy to apply
• Robust physical strength properties
• Outstanding electrical insulator
• Tested for abrasion resistance per ASTM D4060-14
• Passes ASTM E595 for NASA low outgassing