News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Epoxy Features Exceptional Chemical and Heat Resistance Release Date: 03/12/2020 Product: EP35SP Master Bond EP35SP is a two part epoxy system for bonding and sealing applications, providing resistance to many chemicals such as oils, acids, bases, water, fuels, and especially petrochemicals. It features both a high glass transition temperature (T_g) and a broad service temperature range. Its T_g measures… Read More...
	Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature Release Date: 01/27/2020 Product: EP17HTS-DA Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system. Typically, glass transition temperature (T_g) declines with the addition of a filler like silver. However, with this specialty formulation, a high T… Read More...
	Tough Epoxy Polysulfide Adhesive Resists High Temperatures Release Date: 01/14/2020 Product: EP21TPHT Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient… Read More...
	Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications Release Date: 12/20/2019 Product: EP30DPBFMed Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance with the EU directive 2015/863/EU.… Read More...
	Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation Release Date: 11/21/2019 Product: EP29LPTCHT Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine… Read More...