News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.
 

Release Date:
Product: EP21NS

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. It has a nanosilica filler that imparts dimensional stability and abrasion resistance. When measured according to ASTM D4060, standard test method for abrasion resistance, with CS-17 wheel for 1,000 cycles, EP21NS…

Release Date:
Product: UV15X-6Med-2LV

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance. Not only can it be utilized for bonding, but it can also be employed for sealing, coating, and encapsulating purposes. It has a high degree of flexibility with an elongation that exceeds 100% and a low…

Release Date:
Product: EP4EN-80

Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-…

Release Date:
Product: MasterSil 151S

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material. A unique feature of this product is that despite its silicone chemistry, it passes NASA low outgassing specifications. Also, it retains superior electrical conductivity…

Release Date:
Product: EP21ARLV

Master Bond EP21ARLV is a two part epoxy that may be used as an adhesive, sealant, coating or encapsulant. The product is capable of withstanding prolonged exposure to a wide range of chemicals, such as 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate to name a few. Both parts A and B have a low…