News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Non-Premixed and Frozen, One Part Epoxy for Chip Coating Release Date: 06/25/2019 Product: Supreme 3CCM-85 Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-… Read More...
	Optically Clear, Low Viscosity Epoxy System Features High Flexibility Release Date: 06/06/2019 Product: EP88FL Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume. EP88FL withstands thermal cycling and shock. It is ideal in applications where stress… Read More...
	Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance Release Date: 05/15/2019 Product: Supreme 17HT Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath,… Read More...
	Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements Release Date: 04/22/2019 Product: UV22DC80-1Med Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. As a nanosilica… Read More...
	Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity Release Date: 04/02/2019 Product: EP30NG Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary thermal conductivity of… Read More...