Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP62-1HT Two component, lower viscosity epoxy system featuring superior temperature and unsurpassed chemical resistance, especially to acids Dielectric Constant 4.2 at 75°F, 60 Hz Glass Transition Temperature (Tg) 150-155°C	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +450°F	/tds/ep62-1ht
EP62-1HTMed Two component epoxy with superior temperature and chemical resistance that withstands repeated and aggressive sterilization Glass Transition Temperature (Tg) 150-155°C Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +450°F	/tds/ep62-1htmed
EP62-1HTMed Black Two component epoxy with superior temperature and chemical resistance that withstands repeated and aggressive sterilization Glass Transition Temperature (Tg) 150-155°C Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing	Part A: 55,000-110,000 cps, Part B: 100-1,000 cps	60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +450°F	/tds/ep62-1htmed-black
EP62-1LO High temperature resistant, NASA low outgassing epoxy compound Dielectric Constant 4.2 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-8,000 cps	4-6 hours at 60-70°C, 20-40 minutes at 80-100°C or 10 minutes at 125°C	80-90 Shore D	-60°F to +450°F	/tds/ep62-1lo
EP62-1LPSP Two component, high performance epoxy system featuring convenient handling along with excellent temperature and chemical resistance Tensile Lap Shear Strength 1,800-2,000 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Encapsulation Impregnation Potting Underfill	150-300 cps	Typical cure conditions range from 8-10 hours at 60-70°C, 60-90 minutes at 80-100°C or 30-60 minutes at 125°C. Post curing at 100-150°C for 3-4 hours will help optimize properties.	75-85 Shore D	4K to +400°F	/tds/ep62-1lpsp
EP62-1LPSPMed Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation Glass Transition Temperature (Tg) 80-85°C Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity USP Class VI Medical 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Encapsulation Impregnation Potting Underfill	150-300 cps	8-10 hours at 60-70°C, 60-90 minutes at 80-100°C, or 30-60 minutes at 125°C	75-85 Shore D	4K to +400°F	/tds/ep62-1lpspmed
EP62-1LPSPMed White Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation Dielectric Constant 4.6 Glass Transition Temperature (Tg) 80-85°C	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Impregnation Encapsulation Potting Gap Filling	150-300 cps	Overnight at 75°F followed by either 8-10 hours at 60-70°C, 60-90 minutes at 80-100°C, or 30-60 minutes at 125°C. Post curing at 110-135°C for 2-4 hours will help optimize properties.	75-85 Shore D	4K to +400°F	/tds/ep62-1lpspmed-white
EP62-1Med Two component, biocompatible epoxy compound Dielectric Constant 4.3 Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-8,000 cps	Typical cure schedules range from 4-6 hours at 60-70°C, 20-40 minutes at 80-100°C or 10 minutes at 125°C.	80-90 Shore D	-60°F to +450°F	/tds/ep62-1med
EP65 Two component epoxy system featuring fast setup time and good temperature resistance Dielectric Constant 4.1 Tensile Lap Shear Strength 1,100-1,300 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 11,000-15,000 cps, Part B: 8,000-12,000 cps	full cure generally occurs within 12-24 hours	75-85 Shore D	-60°F to +300°F	/tds/ep65
EP65HT Two component epoxy system featuring the special combination of fast setup times and high temperature resistance Glass Transition Temperature (Tg) 125-130°C Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 55,000-110,000 cps, Part B: 8,000-12,000 cps	10-15 minutes setup, full cure within 12-18 hours at 75°F	75-85 Shore D	-60°F to +400°F	/tds/ep65ht

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).

Discuss Your Application