Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP70CN Two component epoxy system for bonding, sealing, coating and potting featuring a natural curing agent Tensile Strength 11,000-12,000 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	2,500-5,000 cps	overnight at 75°F followed by 3-4 hours at 140-170°F	75-85 Shore D	-100°F to +450°F	/tds/ep70cn
EP75-1 Two component, graphite conductive epoxy system for bonding, sealing, coating Coefficient of Thermal Expansion 10-15 X 10⁻⁶ in/in/°C Volume Resistivity 50-100 ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH NASA Low Outgassing	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: 200-500 cps	overnight at 75°F followed by 1-2 hours at 150-200°F	75-85 Shore D	4K to +250°F	/tds/ep75-1
EP76M Two component, nickel filled epoxy for bonding, sealing and coating Tensile Lap Shear Strength >2,000 psi Volume Resistivity 5-10 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: >500,000 cps, Part B: >900,000 cps	ambient temperatures in 3-5 days or at 200°F in 2-3 hours	>80 Shore D	-60°F to +250°F	/tds/ep76m
EP77M-1 Two component, silver conductive epoxy adhesive system Thermal Conductivity 20-22 BTU•in/(ft²•hr•°F)[2.88-3.17 W/(m•K)] Volume Resistivity <10⁻³ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: >400,000 cps, Part B: 10-35 cps	overnight at 75°F followed by 1-2 hours at 150°F	70-80 Shore D	-60°F to +300°F	/tds/ep77m-1
EP77M-F Two component, silver conductive epoxy adhesive system Thermal Conductivity 10-12 BTU•in/(ft²•hr•°F) [1.44-1.73 W/(m•K)] Volume Resistivity 10⁻³ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	24 hours at 75°F	40-50 Shore D	-100°F to +250°F	/tds/ep77m-f
EP77M-FMed Two component, silver conductive epoxy adhesive system for medical applications Thermal Conductivity 10-12 BTU•in/(ft²•hr•°F) [1.44-1.73 W/(m•K)] Volume Resistivity 10⁻³ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	24 hours at 75°F	40-50 Shore D	-100°F to +250°F	/tds/ep77m-fmed
EP79 Two component, room temperature curing epoxy for bonding, sealing and coating Tensile Modulus 300,000-350,000 psi Volume Resistivity <0.005 ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	flowable	overnight at 75°F followed by a post cure of 1-2 hours at 150-200°F	75-85 Shore D	4K to +275°F	/tds/ep79
EP79FL Two component, room temperature curing epoxy for bonding, sealing and coating Thermal Conductivity 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m•K)] Volume Resistivity <0.005 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	flowable	overnight at 75°F followed by a heat cure of 2-3 hours at 200°F	>50 Shore D	4K to +275°F	/tds/ep79fl
EP88FL Two component, room temperature curing epoxy for bonding, coating, sealing and potting Elongation 30-50% Refractive Index 1.51	RoHS Compliant	Bonding Sealing Coating Potting Gap Filling Encapsulation	800-1,200 cps	overnight at 75°F followed by 1 to 2 hours at 150°F to 200°F	45-55 Shore D	4K to 250°F	/tds/ep88fl
EP90FR-H Two component high strength epoxy system complying with FAR standard 14 CFR 25.853(a) for flame retardancy Dielectric Constant 4.4 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant FAR 25.853(a) for Flame Retardancy	Bonding Sealing Coating Potting Gap Filling Encapsulation Casting	20,000-50,000 cps	overnight at 75°F followed by 2-3 hours at 150-200°F	>80 Shore D	-60°F to +250°F	/tds/ep90fr-h

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).

Discuss Your Application