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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP90FR-HFL Two component toughened epoxy system complying with FAR standard 14 CFR 25.853(a) for flame retardancy Elongation 30-40% Volume Resistivity >10¹⁴ ohm-cm	FAR 25.853(a) for Flame Retardancy RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Potting Casting Gap Filling Encapsulation	3,000-10,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	25-45 Shore D	-60°F to +250°F	/tds/ep90fr-hfl
EP90FR-V Two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy also passes Boeing standard BSS 7238, Revision C for low smoke and BSS 7239, Revision A for toxicity Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant Boeing Standards for Flame Retardancy FAR 25.853(a) for Flame Retardancy	Bonding Sealing Coating Potting Casting Encapsulation Gap Filling	20,000-40,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	>75 Shore D	-60°F to +250°F	/tds/ep90fr-v
EP93AOFR Two component thermally conductive flame retardant epoxy system that complies with FAR standard 14 CFR 25.853(a) for flame retardancy Thermal Conductivity 3.5-4.2 BTU•in/(ft²•hr•°F) [0.5-0.6 W/(m•K)] Volume Resistivity >10¹⁴ ohm-cm	FAR 25.853(a) for Flame Retardancy RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Casting Gap Filling	30,000-150,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	80-85 Shore D	-80°F to +300°F	/tds/ep93aofr
EP93FRHT Two component epoxy system meets the Airbus standards noted below from ABD0031, Issue F, June 8, 2005 for flame retardancy Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	Airbus Standards for Flame Retardancy RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Casting Gap Filling	6,000-9,000 cps	overnight at 75°F followed by 3-5 hours at 150-200°F	80-90 Shore D	-80°F to +400°F	/tds/ep93frht
LED401 One component LED curable system for high performance bonding, sealing, coating and encapsulation Coefficient of Thermal Expansion 60-65 X 10⁻⁶ in/in/°C Dielectric Constant 4.2	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation	100,000-150,000 cps	Cure with LED at 405 nm at ~ 1-4 watts/cm² intensity for 15-30 seconds or longer in thicker sections.	65-75 Shore D	-60°F to +250°F	/tds/led401
LED401 White One component LED curable system for high performance bonding, sealing, coating and encapsulation Coefficient of Thermal Expansion 60-65 X 10⁻⁶ in/in/°C Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation	100,000-200,000 cps	Cure with LED at 405 nm at ~ 1-4 watts/cm² intensity for 15-30 seconds or longer in thicker sections.	65-75 Shore D	-60°F to +250°F	/tds/led401-white
LED405FL3 One component, flexibilized LED curable system Refractive Index 1.51 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Casting Encapsulation Sealing	500-3,000 cps	Cure with LED at 405 nm at ~ 1-4 watts/cm² intensity for 15-30 seconds or longer in thicker sections.	5-15 Shore D	-100°F to 250°F	/tds/led405fl3
LED422DC90 One component, nanosilica filled dual curing LED system allowing for rapid fixturing and subsequent curing by heat. Complies with NASA low outgassing Refractive Index 1.49 Tensile Modulus 475,000-575,000 psi	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling	2,000-15,000 cps	exposure to LED light at 405 nm which induces polymerization in a cross sectional mode, 2-3 mm deep. The cure is then completed by adding heat at 90-95°C for 30-45 minutes.	85-90 Shore D	-80°F to +350°F	/tds/led422dc90
MasterSil 151 Two component, addition curing silicone for potting, encapsulation and sealing Dielectric Strength 450 volts/mil Refractive Index 1.436	RoHS Compliant 1,000 Hours at 85°C/85% RH	Sealing Encapsulation Potting Coating Gap Filling Bonding Casting	Part A: 2,000-4,000 cps, Part B: 50-150 cps	75°F 24-48 hours; 200°F 1-2 hours	50-60 Shore A	-65°F to +400°F	/tds/mastersil-151
MasterSil 151Med Black Two component, biocompatible silicone compound for bonding, potting and encapsulation Dielectric Strength 450 volts/mil Volume Resistivity 10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Encapsulation Potting Coating Sealing Gap Filling Casting	Part A: 2,000-4,000 cps, Part B: 50-150 cps	75°F: 24-48 hours; 200°F: 1-2 hours	40-50 Shore A	-65°F to +400°F	/tds/mastersil-151med-black

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