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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
Supreme 45HT Toughened, two component epoxy system for bonding, sealing and coating Dielectric Constant 4.5 Tensile Lap Shear Strength >2,500 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation Potting	35,000-60,000 cps	250-300°F for 3-4 hours followed by a post cure at 350-400°F for 1-2 hours	80-90 Shore D	-100°F to +450°F	/tds/supreme-45ht
Supreme 45HTND-2LO Black Toughened, two component epoxy system featuring high temperature resistance Dielectric Constant 4.5 Tensile Lap Shear Strength 2,200-2,400 psi	RoHS Compliant NASA Low Outgassing 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	250-300°F for 3-4 hours followed by a post cure at 350-400°F for 1-2 hours	80-90 Shore D	-100°F to +450°F	/tds/supreme-45htnd-2lo-black
Supreme 45HTQ Two component epoxy system for bonding, sealing and casting Tensile Lap Shear Strength 2,100-2,300 psi Tensile Modulus 500,000-550,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Casting Coating Encapsulation Potting	20,000-30,000 cps	4 to 6 hours at 250°F, 4 to 5 hours at 350°F, optimal cure schedule is 300°F for 2 hours, followed by post curing at 350°F for 4 to 6 hours.	80-90 Shore D	-60°F to +450°F	/tds/supreme-45htq
Supreme 45HTQ-4 Two component epoxy system for bonding, sealing and casting Coefficient of Thermal Expansion 30-35 x 10⁻⁶ in/in/°C Dielectric Constant 4.5	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	At 250°F, the cure time is 4-6 hours but at 300°F, this system will cure in 4-5 hours.	85-90 Shore D	-100°F to +450°F	/tds/supreme-45htq-4
Supreme 46HT-1AO Two part, thermally conductive, electrically insulative epoxy for bonding and sealing featuring outstanding heat resistance; requires oven curing Dielectric Strength 450 volts/mil Tensile Modulus 600,000-650,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling	75,000-150,000 cps	2 hours at 300°F, followed by 3-4 hours at 350-400°F.	85-95 Shore D	-100°F to +550°F	/tds/supreme-46ht-1ao
Supreme 46HT-2 Toughened, two component epoxy system for bonding, sealing and coating Dielectric Constant 4.5 T-peel Strength >10 pli	RoHS Compliant	Bonding Sealing Coating Gap Filling	15,000-30,000 cps	250-300°F for 3-4 hours	80-90 Shore D	-100°F to +500°F	/tds/supreme-46ht-2
Supreme 46HT-2ND2 Non-drip, two component epoxy system for bonding, sealing and coating Tensile Lap Shear Strength 2,800-3,000 psi Tensile Modulus 350,000-400,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	250-300°F for 3-4 hours, followed by a post cure at 350-400°F for 1-2 hours	80-90 Shore D	-100°F to +500°F	/tds/supreme-46ht-2nd2
Supreme 46HTQ Two component epoxy system for bonding, sealing and casting Dielectric Constant 4.6 Tensile Lap Shear Strength 2,000-2,200 psi	RoHS Compliant	Bonding Sealing Casting Coating Gap Filling Encapsulation Potting	10,000-25,000 cps	4-6 hours at 250°F and 3-4 hours at 300°F	85-95 Shore D	-60°F to +450°F	/tds/supreme-46htq
Supreme 62-1 Two component epoxy resin system featuring excellent temperature and chemical resistance Dielectric Constant 4.2 Tensile Lap Shear Strength 1,600-1,800 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	15,000-25,000 cps	Typical cure schedules range from 4-6 hours at 140-158°F [60-70°C], 20-40 minutes at 176-212°F [80-100°C] or 10-20 minutes at 257°F [125°C]	75-85 Shore D	-60°F to +450°F	/tds/supreme-62-1
Supreme 70CN Two component, toughened epoxy system for bonding, sealing, coating and potting derived from natural substances Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Potting Encapsulation Gap Filling	8,000-12,000 cps	overnight at 75°F followed by 4-5 hours at 140-170°F	75-85 Shore D	-150°F to +400°F	/tds/supreme-70cn

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