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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
UV15-7LRI One part, UV curable polymer system for bonding, sealing, coating and encapsulating Refractive Index 1.481 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation	2,000-4,000 cps	cures quickly in 10-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts/cm²	55-65 Shore D	-60°F to +250°F	/tds/uv15-7lri
UV15-7NS One part nanosilica filled UV curable system Coefficient of Thermal Expansion 30-35 X 10⁻⁶ in/in/°C Refractive Index 1.55	RoHS Compliant	Bonding Sealing Coating Encapsulation	100-700 cps	UV15-7NS will cure quickly and easily at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts per cm². UV15-7NS normally cures in 20-30 seconds under appropriate conditions.	85-95 Shore D	-80°F to +300°F	/tds/uv15-7ns
UV15-7TK1ANV-3 One component, paste consistency UV curable system Dielectric Constant 3.4 Tensile Modulus 300,000-350,000 psi	RoHS Compliant	Bonding Sealing Encapsulation Coating	paste	15-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output of 20 milliwatts/cm2	70-80 Shore D	-80°F to +300°F	/tds/uv15-7tk1anv-3
UV15DC80-1 One component, UV and heat curable epoxy compound with moderate viscosity Glass Transition Temperature (Tg) 125-135°C Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Coating Sealing Encapsulation Gap Filling	20,000-40,000 cps	10-20 seconds with UV light at 365 nm with 20-40 milliwatts/cm2 of energy; 80°C for 60-90 minutes; post curing for 2-4 hours; 1-2 hours at 125°C	>70 Shore D	-80°F to +350°F	/tds/uv15dc80-1
UV15DC80-10FHC One component, dual cure UV system with lower viscosity Dielectric Constant 3.5 Refractive Index 1.52	RoHS Compliant	Bonding	8,000-12,000 cps	UV portion of the cure is best achieved with UV light at 365 nm with 20-40 milliwatts/cm² of energy; heat curing is readily accomplished with a minimum temperature of 80°C for at least 30-40 minutes; post curing at 100-150°C for 1-2 hours or longer will ultimately yield superior properties	70-85 Shore D	-80°F to +350°F	/tds/uv15dc80-10fhc
UV15DC80-FHC One component, UV and heat curable epoxy compound with moderate viscosity Coefficient of Thermal Expansion 55-65 ppm/°C Glass Transition Temperature (Tg) 125-130°C with post cure	RoHS Compliant	Bonding Sealing Coating Encapsulation	45,000-60,000 cps	UV light 320-365 nm for 20-30 seconds, followed by 80°C for 1 hour	70 - 80 Shore D	-80°F to +350°F	/tds/uv15dc80-fhc
UV15DC80LV-FHC One component, UV and heat curable epoxy compound with very low viscosity Glass Transition Temperature (Tg) >125°C Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Coating Encapsulation Gap Filling Sealing	150-500 cps	UV light 320-365 nm followed by 80°C for 1-2 hours	>70 Shore D	-80°F to +350°F	/tds/uv15dc80lv-fhc
UV15FL Low viscosity, one component, UV curable epoxy with enhanced toughness Glass Transition Temperature (Tg) 80-85°C Refractive Index 1.517	RoHS Compliant	Bonding Sealing Coating	90-330 cps	15-30 seconds under UV light with a wavelength range between 320-365 nm	>75 Shore D	-80°F to +350°F	/tds/uv15fl
UV15LV Low viscosity, one component, UV curable epoxy based system Dielectric Constant 3.25 Refractive Index 1.517	RoHS Compliant	Bonding Coating Sealing	70-120 cps	UV light 320-365 nm for 15-30 seconds	>75 Shore D	-80°F to +300°F	/tds/uv15lv
UV15TK Moderate viscosity, one component, UV curable epoxy based system Refractive Index 1.517 Volume Resistivity >10¹⁴ ohm-cm, 25°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	6,000-12,000 cps	UV light 320-365 nm for 15-30 seconds	>75 Shore D	-80°F to +400°F	/tds/uv15tk

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