Master Bond EP21HTFG is a two component, room temperature curing epoxy adhesive, sealant and coating. Its most outstanding features are easy handling, superb physical strength properties and superior resistance to higher temperatures. The two parts are easy to mix and the ratio is very forgiving either by weight or volume. It cures readily at room temperature or faster at elevated temperatures with the optimum being overnight at room temperature followed by 1-2 hours at 150-200°F.
Bonding
Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving and convenient one to one mix ratio by weight or volume. It cures at ambient temperatures that can be accelerated by adding heat, with the optimum cure schedule being overnight at room temperature, followed by 1-2 hours at 150-200°F. This non-drip viscosity system bonds well and with minimum shrinkage to a wide variety of substrates including metals, composites, glass, ceramics and many plastics and rubbers.
Master Bond EP21AOND is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with an excellent performance profile and easy handling. It has a forgiving one to one mix ratio by weight or volume along with a paste consistency. It cures at ambient temperatures or more rapidly at elevated temperatures with the optimum schedule being overnight at room temperature followed by a few hours at 150-200°F. Most importantly, it is an excellent thermal conductor yet maintains superior electrical insulation values.
Master Bond EP45HTND-2 is a two component epoxy system with exceptional performance as an adhesive, sealant and coating in hostile environments. It is most noteworthy for its exquisite resistance to elevated temperatures and its ability to withstand many problem type chemicals. EP45HTND-2 is a specialty type system with a 100 to 30 mix ratio by weight. It has a paste viscosity and will not flow while curing, but it is easy to mix at room temperature. It requires oven curing for 3-4 hours at 250°F or 2-3 hours at 300°F.
Master Bond EP21H is a two component epoxy system with exceptionally good clarity and a unique optical transmission profile for an epoxy. Nearly all epoxies display minimal light transmission below 330 nm. EP21H has a special crosslinking profile that allows for exceptional light transmission in the 250-365 nm spectra. The light transmission in sections of 0.005 inch or less exceeds almost 95% from 260-2,000 nm. EP21H is easy to handle having a long open time. EP21H will cure at room temperature and it can be accelerated by adding heat.
Master Bond EP3SP5FL-ND2 is a special epoxy adhesive that requires no mixing, offers an unsurpassed curing speed of 1-2 minutes at 300°F and a very good performance profile. It is a paste viscosity with minimal flow upon curing that is easy to apply. Since it requires curing at 300°F, it essentially has unlimited working life at room temperature. It will bond well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics.
Master Bond EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. This system, which is not premixed and frozen, has unlimited working life at room temperature. Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F. Although optimal properties are obtained with the higher temperature cure, the 175-180°F cure provides very good physical strength and electrical insulation values as well. EP3RR-80 has a moderate viscosity with excellent flow.
Master Bond Supreme 45HTND-2 is a two component epoxy system featuring an attractive blend of superior physical properties especially shear and peel strengths for high performance structural bonding applications. It has a fine temperature resistance range of -100°F to +450°F. It is 100% reactive and does not contain any solvents or diluents. Supreme 45HTND-2 is primarily formulated to withstand rigorous thermal cycling, especially when bonding dissimilar substrates.
Master Bond Supreme 11HTLP is a high performance, higher viscosity, two part epoxy for bonding and sealing. It is exceptionally easy to use with a one to one mix ratio by weight or volume. Supreme 11HTLP has a convenient working life and cures readily at room temperature or more quickly at elevated temperatures. The optimum curing schedule is overnight at room temperature, followed by 2-3 hours at 150-200°F. Supreme 11HTLP is formulated to have imposing toughness, which in turn imparts high bond strengths in both the shear and peel mode.
Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply. Supreme 10HTF-1 is a true one part system; it is not premixed and frozen and has an unlimited working life at room temperature. It is rapid curing: 5-10 minutes at 300°F or 15-20 minutes at 250°F. It should be noted that post curing at 250-300°F for 1-2 hours will help optimize the properties.