Master Bond EP76MHT is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing and coating. EP76MHT is easy to use has a thixotropic viscosity with Part A being greater than 700,000 cps and Part B exceeding 1,000,000 cps. It has a paste like consistency and the mix ratio is a forgiving one to one by weight or volume. It has an exceptionally long working life as well. It will cure readily at ambient temperatures in 3-5 days or at 200°F in 2-3 hours.
Bonding
Master Bond EP13SPND-2 is a one component, heat curing epoxy with prominent temperature resistance and stellar bonding attributes. This one part system will cure at temperatures of 300-350°F for 60-90 minutes. For optimum properties, a post cure of 2 hours at 350-400°F is highly recommended. It is primarily used as a structural adhesive. EP13SPND-2 is somewhat exothermic and is typically cured in bond line thickness of 2-8 thousandths of an inch. The system has a paste consistency that is easy to apply and will not flow when cured.