EP29LP
Two part, very low viscosity epoxy for bonding, sealing, potting and filament winding
Key Features
- Room temperature curing epoxy
- Low viscosity
- Long working life
- Low exotherm
- Optically clear
- Used in large encapsulation applications
Typical Properties
Viscosity
600-1,700 cps
Cure Schedule
Optimum cure schedule: 75°F for 12-24 hours, followed by a post cure of 4-5 hours at 200°F.
Hardness
>75 Shore D
Service Temperature Range
-60°F to +250°F
Dielectric Constant
3.9
Dielectric Strength
450 volts/mil
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Certifications
Meets EU Directive 2015/863
Packaging
Case Study
EP29LP: Reference Surfaces for Vehicle Scanner Calibration
To verify vehicle scanner accuracy, Phoenix Scientific Inc. needed a reference surface accurately representing the test pavement, with uniform flatness. Machining or transporting such a precise surface was difficult and costly. Their solution: apply …