Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP30-3LO Highly versatile, two part epoxy system for bonding, coating, sealing and casting Glass Transition Temperature (Tg) 170-175°C Volume Resistivity >10¹⁵ ohm-cm	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Casting Encapsulation Gap Filling	2,000-5,000 cps	1-2 hours at 170°F followed by 2-3 hours at 300°F	80-90 Shore D	-80°F to +450°F	/tds/ep30-3lo
EP30-4 Optically clear, two component epoxy for bonding, coating, sealing and casting Dielectric Constant 4.3 Refractive Index 1.55	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 1,000-3,000 cps, Part B: 20-100 cps	Cure schedule at 75°F: 24 hours.	75-85 Shore D	-60°F to +250°F	/tds/ep30-4
EP30-4Med Two component, optically clear epoxy for medical device applications Dielectric Strength 450 volts/mil Refractive Index 1.55	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 1,000-3,000 cps, Part B: 20-100 cps	75°F for 24 hours or alternative cure 1-2 hours at 75°F followed by 60-90 minutes at 135-150°F	75-85 Shore D	-60°F to +250°F	/tds/ep30-4med
EP30AO Two component, room temperature curing epoxy with excellent thermal transfer properties Coefficient of Thermal Expansion 22-25 X 10⁻⁶ in/in/°C Dielectric Strength >400 volts/mil	ASTM D4060-14 for Abrasion Resistance RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Potting	2,000-6,000 cps	75°F: 24-48 hours; 200°F: 1-2 hours	85-95 Shore D	-60°F to +250°F	/tds/ep30ao
EP30DP-NV Toughened, two component epoxy for bonding, sealing, coating and encapsulation Elongation 30-60% Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling Potting	Part A: 5,000-8,000 cps, Part B: 250-500 cps	Optimal curing is overnight at 75°F followed by 2-4 hours at 150°F.	30-50 Shore D	4K to +250°F	/tds/ep30dp-nv
EP30DPBFMed Two component, toughened epoxy system for bonding, sealing, coating and encapsulation meets USP Class VI requirements Dielectric Constant 3.9 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 3,000-6,000 cps, Part B: 200-500 cps	overnight at 75°F followed by 2-4 hours at 150°F	30-50 Shore D	4K to +250°F	/tds/ep30dpbfmed
EP30DPSP Toughened, two component epoxy for bonding, sealing, coating and encapsulation Coefficient of Thermal Expansion 85-95 X 10⁻⁶ in/in/°C Elongation 20-30%	RoHS Compliant	Bonding Sealing Coating Encapsulation Potting	Part A: 1,500-3,000 cps, Part B: 250-500 cps	overnight at 75°F followed by 3-4 hours at 140-180°F	40-50 Shore D	4K to +250°F	/tds/ep30dpsp
EP30FL Two component epoxy system for high performance potting, casting, bonding and sealing Dielectric Constant 3.83 Refractive Index 1.57	RoHS Compliant	Bonding Sealing Encapsulation Potting Gap Filling Coating	Part A: 700-1,200 cps, Part B: 60-120 cps	12-24 hours at ambient temperatures followed by 2-3 hours at 140-170°F	25-40 Shore D	4K to +250°F	/tds/ep30fl
EP30HT Two component epoxy system for bonding, sealing, coating and potting featuring optical clarity and high temperature resistance Dielectric Constant 3.5 Refractive Index 1.54	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	Part A: 55,000-110,000 cps, Part B: 250-500 cps	24-48 hours at 75°F; 2-3 hours at 200°F	80-90 Shore D	-60°F to +400°F	/tds/ep30ht
EP30HT-LO NASA low outgassing approved adhesive, sealant, coating and potting compound Dielectric Strength 440 volts/mil Refractive Index 1.54	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding	Part A: 55,000-110,000 cps, Part B: 250-500 cps	24-48 hours at 75°F; 2-3 hours at 200°F	80-90 Shore D	-60°F to +400°F	/tds/ep30ht-lo

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