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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP39MAOHT Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system Dielectric Constant 4.8 Tensile Lap Shear Strength 1,400-1,600 psi	MIL-STD-810G for Fungus Resistance RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Casting Gap Filling	3,000-6,000 cps	75°F: 3-5 days; 150-200°F: 3-4 hours; optimum cure schedule: overnight at 75°F plus 3-5 hours at 150-200°F	80-90 Shore D	-100°F to +400°F	/tds/ep39maoht
EP39MHT Two component, low viscosity, room temperature curing epoxy resin system Elongation 70-90% Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Potting Casting Gap Filling	1,500-3,000 cps	75°F in 3-4 days; accelerated by heat curing for 3-4 hours at 150-200°F; optimum cure schedule overnight at 75°F followed by 2-4 hours at 150-200°F.	75-85 Shore D	-100°F to +400°F	/tds/ep39mht
EP3HT One component epoxy system for bonding, sealing and coating Dielectric Constant 3.7 Tensile Lap Shear Strength 2,000-2,200 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/tds/ep3ht
EP3HTMed One part, heat curing, biocompatible epoxy compound Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes, followed by 1 to 3 hours at +250 to +300°F	80-90 Shore D	-60°F to +400°F	/tds/ep3htmed
EP3HTND-2 Black One part, heat curing black epoxy compound with paste consistency Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/tds/ep3htnd-2-black
EP3HTND-2Med Black One part, heat curing, biocompatible epoxy compound with paste consistency Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Gap Filling	paste	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-60°F to +400°F	/tds/ep3htnd-2med-black
EP3HTS One part, electrically conductive epoxy system Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	RoHS Compliant	Bonding Sealing Gap Filling Coating	paste	45-90 minutes at 250°F or 20-40 minutes at 300°F	65 Shore D	-60°F to +400°F	/tds/ep3hts
EP3HTS-LO One part, high performance, electrically conductive epoxy, NASA low outgassing compliant Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Cures readily at 250°F at 45-50 minutes or in just 20-30 minutes at 300°F.	65-75 Shore D	-60°F to +400°F	/tds/ep3hts-lo
EP3HTSCN One part, high performance, electrically conductive epoxy Tensile Lap Shear Strength 900-1,100 psi Volume Resistivity 0.05 to 0.10 ohm-cm	RoHS Compliant	Coating Bonding Sealing Gap Filling	paste	cures readily at 250°F at 45-50 minutes or in just 20-30 minutes at 300°F	75-85 Shore D	-60°F to +400°F	/tds/ep3htscn
EP3HTSDA-2Med One component, medical grade, electrically conductive epoxy featuring exceptionally high thermal conductivity Thermal Conductivity 45-49 BTU•in/(ft²•hr•°F) W/(m•K)] Volume Resistivity <0.001 ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Die Attach Gap Filling Sealing Coating	>400,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	75-85 Shore D	-80°F to +450°F	/tds/ep3htsda-2med

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