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EP30P Two Component Epoxy
EP30P
Low viscosity, two component epoxy system with excellent performance and compatibility with polycarbonates, acrylics and glass
Dielectric Constant
3.6
Refractive Index
1.56
  • FDA Food Grade 21 CFR 175.105
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
1,200-1,400 cps 75°F: 24-48 hours; 200°F: 2-3 hours >75 Shore D -60°F to +250°F /tds/ep30p
EP30QF Two Part Epoxy Compound
EP30QF
Quartz filled, two part epoxy system for high performance bonding, sealing, coating & casting
Coefficient of Thermal Expansion
20-25 x 10⁻⁶ in/in/°C
Dielectric Constant
4.3
  • NASA Low Outgassing
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Potting
  • Encapsulation
  • Gap Filling
Part A: 25,000-40,000 cps, Part B: 1,000-4,000 cps At 75°F, it cures in 1-2 days. Alternatively, at 150-200°F, it will cure in 1-2 hours. 80-90 Shore D -60°F to +250°F /tds/ep30qf
EP31 Two Component Epoxy System
EP31
Two component epoxy system featuring exceptional bonding strength properties
T-peel Strength
>50 pli
Tensile Modulus
300,000-350,000 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
Part A: 9,000-15,000 cps, Part B: 10-100 cps cures in about 1-2 days at ambient temperatures, and in about 2-3 hours at 200°F; an overnight cure at 75°F followed by 2-3 hours at 150-200°F is desirable 70-80 Shore D -60°F to +250°F /tds/ep31
EP31ND Two Part Epoxy Adhesive
EP31ND
Two component epoxy system featuring exceptional bonding strength properties and paste consistency
Dielectric Strength
440 volts/mil
Tensile Lap Shear Strength
4,000-4,200 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Encapsulation
  • Coating
  • Gap Filling
Paste cures in about 1-2 days at ambient temperatures, 2-3 hours at 200°F; overnight cure at 75°F followed by 2-3 hours at 150-200°F is desirable 70-80 Shore D -60°F to +250°F /tds/ep31nd
EP33
Two component, room temperature curing epoxy for bonding, sealing and coating
Tensile Modulus
400,000-450,000 psi
Volume Resistivity
>10¹² ohm-cm
  • MIL-STD-883J for Thermal Stability
  • NASA Low Outgassing
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
Part A: 100,000-150,000 cps, Part B: 1,500-3,000 cps 75°F: 48-72 hours; 200°F: 1-2 hours 80-90 Shore D -60°F to +450°F /tds/ep33
EP33CLV Two Part Epoxy
EP33CLV
Two component, room temperature curing epoxy for bonding, sealing, coating and encapsulation featuring high temperature resistance
Coefficient of Thermal Expansion
35-40 X 10⁻⁶ in/in/°C
Dielectric Constant
4.4
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
Part A: 30,000-70,000 cps, Part B: 1,500-3,000 cps 75°F: 48-72 hours; 200°F: 1-2 hours; Optimum cure schedule: Overnight 75°F followed by 150-200°F for 2-3 hours 80-85 Shore D -60°F to +450°F /tds/ep33clv
EP33LV Two Part Epoxy
EP33LV
Two component, lower viscosity epoxy adhesive for bonding, sealing and coating
Dielectric Constant
5.5
Tensile Lap Shear Strength
2,000-2,200 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
  • Encapsulation
14,000-18,000 cps overnight at 75°F followed by a post cure at 150-200°F for 2-3 hours 85-90 Shore D -60°F to +450°F /tds/ep33lv
EP35 Two Part Epoxy
EP35
Two component, room temperature curing epoxy for bonding, sealing and coating
Tensile Lap Shear Strength
2,000-2,200 psi
Tensile Modulus
400,000-450,000 psi
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: 100,000-150,000 cps, Part B: 1,500-3,000 cps Overnight at 75°F followed by post cure at 150-200°F for 2-3 hours 80-90 Shore D -60°F to +450°F /tds/ep35
EP35AOLV
Two component, thermally conductive, electrically isolating epoxy system for bonding, sealing and potting
Glass Transition Temperature (Tg)
165-170°C
Tensile Lap Shear Strength
900-1,100 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
50,000-90,000 cps 2-3 hours at 300°F followed by a post cure of 3-4 hours at 300-350°F 85-95 Shore D -60°F to +500°F /tds/ep35aolv
EP35SP Two Part Epoxy
EP35SP
Two component epoxy system for bonding, sealing and coating applications
Glass Transition Temperature (Tg)
215-220°C
Tensile Lap Shear Strength
2,200-2,400 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
paste 1 hour at 110°C, followed by 2 to 3 hours at 125-150°C, with a post cure at 175°C for 2 to 3 hours 85-95 Shore D -80°F to +550°F /tds/ep35sp

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