Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP36 One component, B-staged epoxy for potting, encapsulation, coating and bonding Glass Transition Temperature (Tg) 95-100°F [35-37.8°C] Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Coating Encapsulation Potting Gap Filling	80,000-120,000 cps	350°F for 2-3 hours	80 Shore D	-100°F to +500°F	/tds/ep36
EP36AN One component, B-stage epoxy for potting, encapsulation, coating and bonding Coefficient of Thermal Expansion 75-85 in/in X 10⁻⁶/°C Dielectric Strength 440 volts/mil	MIL-STD-810G for Fungus Resistance RoHS Compliant	Bonding Coating Encapsulation Potting	90,000-130,000 cps	350°F for 2-3 hours	80 Shore D	-100°F to +500°F	/tds/ep36an
EP36AO One component, B-staged epoxy for potting, encapsulation, coating and bonding Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 95-100°F [35-37.8°C]	NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Potting Gap Filling	80,000-120,000 cps	liquefy at 200°F, cure at 350°F for 2-3 hours	80 Shore D	-100°F to +500°F	/tds/ep36ao
EP36CLV One component, B-staged epoxy for potting, sealing, coating and bonding Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 93°F [34°C]	RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	6,000-25,000 cps	2-3 hours at 350°F after liquefying at 200°F for about 30 minutes	70-75 Shore D	-100°F to +500°F	/tds/ep36clv
EP36FR One component, B-staged epoxy for potting, encapsulation, coating and bonding; meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy Dielectric Constant 4.7 Dielectric Strength 440 volts/mil	RoHS Compliant FAR 25.853(a) for Flame Retardancy Airbus Standards for Flame Retardancy	Bonding Sealing Coating Encapsulation Potting Gap Filling	80,000-120,000 cps	liquefy at minimum 200°F then cure at 350°F, hours: 2-3 hours	80 Shore D	-100°F to +500°F	/tds/ep36fr
EP37-3FLF Two component, room temperature curing epoxy for bonding, casting and coating Acoustical Impedance 2.5 MRayl Refractive Index 1.536	RoHS Compliant	Bonding Coating Casting Encapsulation Sealing Gap Filling	600-1,200 cps	overnight at 75°F, followed by a post cure at 135-165°F for 3-5 hours	25-35 Shore D	4K to +250°F	/tds/ep37-3flf
EP37-3FLFAO Two component epoxy compound for potting, bonding, sealing and coating Dielectric Strength 450 volts/mil Tensile Modulus 30,000-40,000 psi	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant MIL-STD-810G for Fungus Resistance	Bonding Sealing Coating Potting Encapsulation Gap Filling	Part A: 6,000-11,000 cps, Part B: 7,000-12,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours; Optimal cure: Overnight at 75°F followed by post cure at 135-165°F for 3-5 hours	35-45 Shore D	4K to +250°F	/tds/ep37-3flfao
EP37-3FLFAOND Two component epoxy compound for bonding, sealing and encapsulation Dielectric Constant 4.9 Tensile Modulus 30,000-40,000 psi	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: paste	75°F: 2-3 days; 150-200°F: 2-4 hours	35-45 Shore D	4K to +250°F	/tds/ep37-3flfaond
EP38CL Two component high performance epoxy for bonding, sealing, coating and encapsulation Tensile Modulus 300,000-350,000 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling	1,000-4,000 cps	75°F for 24-48 hours, 200°F for 1-2 hours	75-85 Shore D	-100°F to +250°F	/tds/ep38cl
EP39-2 Two component, low viscosity, room temperature curing epoxy for bonding, sealing, coating and casting Dielectric Constant 4.3 Refractive Index 1.55	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Casting Gap Filling Encapsulation Potting	2,000-4,000 cps	3-4 hours at ambient temperatures followed by 2-3 hours at 140-170°F	75-85 Shore D	-60°F to +300°F	/tds/ep39-2

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).

Discuss Your Application