EP3SP5FL

Master Bond EP3SP5FL is a special epoxy adhesive that requires no mixing, offers an unsurpassed curing speed of 1-2 minutes at 300°F and a very good performance profile. This liquid has a moderate viscosity with good flow properties that is easy to apply. Since it requires curing at 300°F, it essentially has unlimited working life at room temperature. It will bond well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics. EP3SP5FL has very good tensile lap shear strength when bonding aluminum to aluminum along with other potent physical strength properties. It resists water, oils and fuels quite well. Other desirable features include low shrinkage upon curing and highly effective electrical insulation values. Also, it stands up briskly to thermal cycling as well as impact and shock. The service temperature range is -60°F to +200°F. Most notably, EP3SP5FL softens markedly above 200°F and this characteristic can allow the epoxy to be more readily reworkable than most other epoxy type systems. This system is amber in color. EP3SP5FL is considered a “snap cure” type epoxy system and can be used in a variety of applications in the aerospace, electronics and specialty OEM industries, among others, particularly when ultra fast curing and repairability are desirable features.

Product Advantages

• Single component system; no mixing needed
• Unlimited working life at room temperature
• Snap cure type system; 1-2 minutes at 300°F
• Moderate viscosity, convenient handling
• Bonds well to a wide variety of substrates
• Fine electrical insulation properties
• More easily repairable than most epoxy systems