Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP3HTSMed One part, electrically conductive, biocompatible epoxy system Tensile Lap Shear Strength >400 psi Volume Resistivity <0.001 ohm-cm	USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	40-90 minutes at 250°F or 20-40 minutes at 300°F (minimum cure temperature is 235-240°F)	60-80 Shore D	-60°F to +400°F	/tds/ep3htsmed
EP3RR-80 One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher Dielectric Constant 4.4 Volume Resistivity 10¹⁴ ohm-cm	MIL-STD-810G for Fungus Resistance NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Sealing Encapsulation Potting Bonding	60,000-120,000 cps	Cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F	80-90 Shore D	-100°F to +350°F	/tds/ep3rr-80
EP3SP5FL-ND2 One component “snap cure” epoxy adhesive with paste viscosity Elongation 10-15% Tensile Lap Shear Strength >2,000 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	1-2 minutes at 300°F	>85 Shore D	-60°F to +200°F	/tds/ep3sp5fl-nd2
EP3UF One component epoxy for bonding and underfill applications Dielectric Strength 450 volts/mil Volume Resistivity >10¹² ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Underfill Sealing Coating Encapsulation	10,000-40,000 cps	20-30 minutes at 250°F or 10-15 minutes at 300°F	80-90 Shore D	-60°F to +300°F	/tds/ep3uf
EP3UF-1 One component epoxy for bonding and underfill applications Dielectric Strength 450 volts/mil Volume Resistivity >10¹² ohm-cm	RoHS Compliant	Bonding Underfill Sealing Coating Encapsulation	5,000-15,000 cps	20-30 minutes at 250°F or 10-15 minutes at 300°F	80-90 Shore D	-60°F to +250°F	/tds/ep3uf-1
EP40 Two component, room temperature curing epoxy system with good toughness; meets NASA low outgassing specifications Dielectric Constant 4.1 Elongation 80-90%	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 9,000-16,000 cps, Part B: 6,000-8,000 cps	overnight at 75°F followed by 2-3 hours at 120°F to 150°F	50-60 Shore D	-100°F to +250°F	/tds/ep40
EP40Med Two component, room temperature curing epoxy with high elongation Dielectric Constant 4.1 Elongation 80-90%	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 9,000-16,000 cps, Part B: 6,000-8,000 cps	overnight at 75°F followed by 2-3 hours at 120°F to 150°F	50-60 Shore D	-80°F to +250°F	/tds/ep40med
EP40ND Two component, room temperature curing epoxy with good toughness, paste consistency Elongation 80-90% Tensile Lap Shear Strength 1,600-1,800 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 50,000-100,000 cps, Part B: paste	overnight at 75°F, followed by a post cure at 120-150°F for 2-3 hours	50-60 Shore D	-100°F to +250°F	/tds/ep40nd
EP40NDMed Two component, medical grade epoxy with good toughness and paste consistency Elongation 80-90% Volume Resistivity >10¹⁵ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 50,000-100,000 cps, Part B: paste	overnight at 75°F followed by 2-3 hours at 120°F to 150°F	50-60 Shore D	-100°F to +250°F	/tds/ep40ndmed
EP40TC Two component, thermally conductive, electrically insulative epoxy system for bonding and sealing Elongation 60-70% Tensile Lap Shear Strength 2,300-2,500 psi	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling	80,000-100,000 cps	overnight at 75°F followed by 3-5 hours at 125°F to 150°F	70-80 Shore D	-100°F to +300°F	/tds/ep40tc

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