Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP40TCMed Two component, thermally conductive, electrically insulative epoxy system for medical device applications Elongation 60-70% Tensile Lap Shear Strength 2,300-2,500 psi	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Gap Filling Coating	80,000-100,000 cps	overnight at 75°F followed by 3-5 hours at 125°F to 150°F	70-80 Shore D	-100°F to +300°F	/tds/ep40tcmed
EP41S-1 Two component, epoxy adhesive, sealant and coating resists harsh chemicals Dielectric Strength 440 volts/mil Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation	Part A: 10,000-15,000 cps, Part B: 250 - 400 cps	75°F for 24-48 hours, 200°F for 2-3 hours	>75 Shore D	-60°F to +300°F	/tds/ep41s-1
EP41S-5 Two component epoxy system featuring excellent chemical resistance especially to solvents, acids, bases, alcohols and fuels Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 140-145°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Potting Casting Encapsulation Gap Filling	25,000-30,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	85-95 Shore D	-80°F to +450°F	/tds/ep41s-5
EP41S-5LV Two component epoxy system featuring excellent chemical resistance especially to solvents, acids, bases, alcohols and fuels Glass Transition Temperature (Tg) 120-125°C Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling	2,000-5,000 cps	75°F: 3-5 days; 150-200°F: 2-3 hours	85-95 Shore D	-80°F to +350°F	/tds/ep41s-5lv
EP41S-5Med Two component epoxy system featuring excellent resistance to sterilants, solvents and autoclaving Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 140-145°C	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	25,000-30,000 cps	75°F: 3-5 days; 150-200°F: 2-3 hours; Optimal cure schedule: overnight at 75°F, plus 3-4 hours at 200°F	85-95 Shore D	-80°F to +450°F	/tds/ep41s-5med
EP41S-5ND Black Two component epoxy system featuring excellent chemical resistance especially to solvents, acids, bases, alcohols and fuels Glass Transition Temperature (Tg) 140-145°C Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling Encapsulation	Part A: paste, Part B: paste	overnight at 75°F followed by 3-4 hours at 150-200°F	85-95 Shore D	-80°F to +450°F	/tds/ep41s-5nd-black
EP41S-6 Two component epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 145-150°C	RoHS Compliant UL 1203 for Explosion-Proof & Dust-Ignition-Proof	Bonding Sealing Coating Potting Casting Encapsulation Gap Filling	30,000-60,000 cps	24 hours at room temperature followed by 10 hours at 125°C	85-95 Shore D	-80°F to +500°F	/tds/ep41s-6
EP41S-LO Versatile two part epoxy system for bonding, sealing, coating and potting that meets NASA low outgassing specifications Tensile Modulus 300,000-350,000 psi Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	Part A: 10,000-15,000 cps, Part B: 3,000-5,000 cps	cures in 24 hours at 75°F, in 60-90 minutes at 200°F	>75 Shore D	-60°F to +250°F	/tds/ep41s-lo
EP41SMed Two part epoxy system for bonding, sealing, coating and potting that meets USP Class VI and ISO 10993-5 for medical applications Dielectric Constant 3.6 Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Potting Encapsulation Gap Filling	Part A: 10,000-15,000 cps, Part B: 3,000 - 5,000 cps	24 hours at 75°F, 60-90 minutes at 200°F, optimum cure schedule overnight at 75°F followed by 1-2 hours at 150-200°F	>75 Shore D	-60°F to +250°F	/tds/ep41smed
EP42-2LV Two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance Refractive Index 1.61 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Casting Encapsulation Gap Filling Potting	Part A: 10,000-15,000 cps, Part B: 30 - 70 cps	cures at ambient or elevated temperatures, with the optimum being overnight at 75°F followed by 2-4 hours at 150-200°F	75-85 Shore D	-60°F to +350°F	/tds/ep42-2lv

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